... to particle adhesion ( 5 6 7 8 9 10 11 12 ), whereas chemical bonds and frictional forces at the interfaces have been neglected. CMP post-CMP cleaning interfacial force friction lubrication Sommerfeld grouping adhesion chemical mechanical polishing elemental semiconductors...

... orientation indentation atomic force microscopy surface morphology viscoplasticity hysteresis stress analysis phase transformations densification elastic deformation plastic deformation silicon elemental semiconductors nanotribology abrasive wear nanoscratch nanoindentation...

... 08 03 2006 copper silicon metallic thin films elemental semiconductors slurries chemical mechanical polishing lubrication wear surface roughness abrasives During the chemical mechanical polishing (CMP) process, a rotating wafer is pressed against a rotating, resilient...

... system. Manuscript received February 24, 2004; revision received September 23, 2004. Review conducted by: T. Kato. 24 February 2004 23 September 2004 07 02 2005 silicon elemental semiconductors micromechanical devices mechanical contact adhesion stiction rough...

... JOURNAL OF TRIBOLOGY . Manuscript received by the Tribology Division August 6, 2003; revised manuscript received October 17, 2003. Associate Editor: J. A. Tichy. 06 August 2003 17 October 2003 28 06 2004 diamond-like carbon silicon elemental semiconductors thin films friction...

... copper chemical mechanical polishing Young's modulus elastic deformation plastic deformation abrasion lubrication tribology surface topography rough surfaces silicon elemental semiconductors metallisation indentation sliding friction planarisation metallic thin films Chemical...